Transport of Sputtered Particles in Capacitive Sputter Sources

Jan Trieschmann, Thomas Mussenbrock

Journal of Applied Physics 118, 033302 (2015)


Abstract

The transport of sputtered aluminum inside a multi frequency capacitively coupled plasma chamber is simulated by means of a kinetic test multi-particle approach. A novel consistent set of scattering parameters obtained for a modified variable hard sphere collision model is presented for both argon and aluminum. An angular dependent Thompson energy distribution is fitted to results from Monte Carlo simulations and used for the kinetic simulation of the transport of sputtered aluminum. For the proposed configuration the transport of sputtered particles is characterized under typical process conditions at a gas pressure of p=0.5 Pa. It is found that -- due to the peculiar geometric conditions -- the transport can be understood in a one dimensional picture, governed by the interaction of the imposed and backscattered particle fluxes. It is shown that the precise geometric features play an important role only in proximity to the electrode edges, where the effect of backscattering from the outside chamber volume becomes the governing mechanism.

[J. Applied Physics] [arxiv.org] [DOI]

tags: ccp, sputtering, TMPM, TPM