course: Halbleitertechnologie 2

number:
141388
teaching methods:
lecture with tutorials
media:
overhead transparencies, handouts, black board and chalk
responsible person:
Prof. Dr.-Ing. Martin Hoffmann
lecturer:
Prof. Dr.-Ing. Martin Hoffmann (ETIT)
language:
german
HWS:
3
CP:
4
offered in:
summer term

dates in summer term

  • start: Wednesday the 29.04.2020
  • lecture Wednesdays: from 08:30 to 10.00 o'clock
  • tutorial Wednesdays: from 10:15 to 11.00 o'clock

Exam

All statements pertaining to examination modalities (for the summer/winter term of 2020) are given with reservations. Changes due to new requirements from the university will be announced as soon as possible.

Date according to prior agreement with lecturer.

Form of exam:oral
Registration for exam:FlexNow
Duration:30min

goals

This course presents primarily technologies of microsystems technology which surpass the construction of simple electronic structures but are based largely on the processes of semiconductor technology. This also encompasses methods suitable to produce mechanical and fluidic systems. References to practical applications are made.

The students will become acquainted with the different methods of additive and substractive production of structures and will be able to assess their pros and cons. This course will also address the topics of procedural conditions (vacuum, basics of plasma technology) and clean room technology, as far as they are necessary to the understanding of the processes.

content

  • Comparison of macroscopic and microscopic production processes
  • Limitations and possibilities of optical microscopy
  • Contaminations and clean room technology to avoid them
  • Silicon as a micromechanical material
  • Physical vapour deposition: specific properties of sputtering and vapour deposition
  • Materials: piezoelectric aluminium nitrate, materials for structures and sacrificial layers, reactive layer systems, Bragg angle deposition of nano structures
  • Additive methods: vapour deposition, electroplating and currentless deposition
  • LIGA – lithography and galvanic moulding: development and applications
  • Dry etching processes: ranging from highly selective to massively anisotropic
  • Three-dimensional structures in silicon: anisotropic wet etching processes
  • Introduction into nano imprint lithography (NIL)

requirements

Keine

recommended knowledge

Bachelor of Electrical Engineering; Knowledge of technology is helpful, but not necessary.

miscellaneous

Im Som­mer­se­mes­ter 2020 wird die­se Vorlesung als on­line-ge­stütz­te Ver­an­stal­tung ohne Prä­senz­ver­an­stal­tun­gen durch­ge­führt.

Beginn ist Mittwoch, der 29.04.2020.

Die Anmeldung erfolgt über Moodle ab Montag, den 20.04.2020.